Risk factor
Moderate default risk
Profitability factor
Greatly overvalued vs peers
About
Shenzhen Danbond Technology Co.,Ltd. engages in the research, development, manufacture, and sale of flexible circuits and its materials primarily in China. The company offers FCCL single and double side substrates used in LCD monitors, LCD TVs, cameras, mobile phones, netbooks, e-books, cars, etc.; COF flexible encapsulation substrates; chip on flexible printed circuit products used in LCD TVs, smart 3G phones and laptop computers, and other products with LCD display drivers; and flexible printed circuit boards. It also provides encapsulation-related heat curing adhesive and micro adhesive glue films. The company was founded in 2001 and is based in Shenzhen, China. Shenzhen Danbond Technology Co.,Ltd. is a subsidiary of Shenzhen Danbang Investment Group Co., Ltd.
Company Valuation
Based on key historical and expected multiples, the stock is greatly overvalued relative to its peers. Specifically, the stock is 'expensive' on P/E, overvalued on EV/EBI
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