Risk factor
Negligible price volatility
Profitability factor
Solid dividends
About
Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of metal, gold, and tin-lead bumps; flip chips; and tape and reel bonding and packaging substrates in Taiwan, the United States, and internationally. The company offers turnkey services, which comprise bumping manufacturing services, including gold, solder, and copper bumping services;...
Company Valuation
From both historical and forecast perspectives, the stock is moderately underpriced compared to similar stocks. In particular, the stock is underpriced on P/E, 'cheap' on
Target Price
The average target price of 6147.TWO is 55 and suggests 3% upside potential. Usually, this means a HOLD recommendation among investment firms. This neutral recommendation
